JPH0184439U - - Google Patents

Info

Publication number
JPH0184439U
JPH0184439U JP1987180480U JP18048087U JPH0184439U JP H0184439 U JPH0184439 U JP H0184439U JP 1987180480 U JP1987180480 U JP 1987180480U JP 18048087 U JP18048087 U JP 18048087U JP H0184439 U JPH0184439 U JP H0184439U
Authority
JP
Japan
Prior art keywords
wafer
holder
scratches
irregularly shaped
cleavage direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987180480U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987180480U priority Critical patent/JPH0184439U/ja
Publication of JPH0184439U publication Critical patent/JPH0184439U/ja
Pending legal-status Critical Current

Links

JP1987180480U 1987-11-26 1987-11-26 Pending JPH0184439U (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987180480U JPH0184439U (en]) 1987-11-26 1987-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987180480U JPH0184439U (en]) 1987-11-26 1987-11-26

Publications (1)

Publication Number Publication Date
JPH0184439U true JPH0184439U (en]) 1989-06-05

Family

ID=31471998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987180480U Pending JPH0184439U (en]) 1987-11-26 1987-11-26

Country Status (1)

Country Link
JP (1) JPH0184439U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149046A (ja) * 2007-11-28 2009-07-09 Denso Corp 基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763845A (en) * 1980-10-06 1982-04-17 Nec Corp Dividing device for semicondutor wafer
JPS60137038A (ja) * 1983-12-26 1985-07-20 Toshiba Corp 半導体ウエ−ハのへき開方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5763845A (en) * 1980-10-06 1982-04-17 Nec Corp Dividing device for semicondutor wafer
JPS60137038A (ja) * 1983-12-26 1985-07-20 Toshiba Corp 半導体ウエ−ハのへき開方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149046A (ja) * 2007-11-28 2009-07-09 Denso Corp 基板の製造方法

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